Corrosion electrochemical mechanism of chemical mechanical polishing of copper in K3Fe(CN)6 solution

Polarization curves of copper were measured in NH3*H2O media containing K3Fe(CN)6. Components of passive film were analyzed by XPS. Relation of polishing rate with corrosion current density was investigated during CMP. Copper can be passivated in the slurry and main component of passive film is Cu4Fe(CN)6. Relation of polishing rate with corrosion current density is linear direct ratio and expressed as R=KJcorr during CMP. Coefficient K varies with different slurry systems but is constant under experimental conditions, which does not vary with NH3*H2O, K3Fe(CN)6, γ-Al2O3 concentrations, polishing pressures and rotative rate in a slurry system during CMP.