Progress in material removal mechanisms of surface polishing with ultra precision

Chemical mechanical polishing (CMP) processis commonly regarded as the best method for achievingglobal planarization in the field of surface finishing withultra-precision. The development of investigation on materialremoval mechanisms for different materials used in com-puter hard disk and ultra-large scale integration fabricationare reviewed here. The mechanisms underlying the interac-tion between the abrasive particles and polished surfacesduring CMP are addressed, and some ways to investigate thepolishing mechanisms are presented.