Thermal Analysis of High Power LED on Heat Sink
- 期刊名字:半导体光子学与技术(英文版)
- 文件大小:
- 论文作者:WANG Cai-feng,NIU Ping-juan,GA
- 作者单位:School of Information and Communication Engineering
- 更新时间:2023-02-07
- 下载次数:次
论文简介
Thermal management of LED junction temperature is one of the fundamental technologies for LED lamp to ensure basic specifications in many aspects. Analysed is the high power LED's distribution on heat sink. Using mathematical statistical methods, a formula is conlcuded to calculate the size of heat sink under LED safe working temperature, which provides a method to researchers and LED lamp manufacturers.
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