Mechanism and prediction of failure of diamond films deposited on various substrates by HFCVD

Diamond films were deposited on the WC-Co cemented carbide and Si3N4 ceramic cutting tool substrates by hot-filament-assisted chemical vapour deposition. The adherence property of diamond films was estimated using the critical load (Pcr) in the indentation test. The adhesive strength of diamond films is related to the intermediate layer between the film and the substrate. Poor adhesion of diamond films to polished cemented carbide substrate is owing to the formation of graphite phase in the interface. The adhesion of diamond films deposited on acid etched cemented carbide substrate is improved, and the peeling-off of the films often happens in the loosen layer of WC particles where the cobalt element is nearly removed. The diamond films' adhesion to cemented carbide substrate whose surface layer is decarbonizated is strengthened dramatically because WC phase forms by reaction between the deposited carbon and tungsten in the surface layer of substrates during the deposition of diamond, which results in chemical combination in the film-substrate interface. The adhesion of diamond films to silicon nitride substrate is the firmest due to the formation of chemical combination of the SiC intermediate layer in the interfaces. In the piston-turning application, the diamond-coated Si3N4 ceramic and the cemented carbide cutting tools usually fail in the form of collapsing of edge and cracking or flaking respectively. They have no built-up edge(BUE) as long as coating is intact.As it wears through, BUE develops and the cutting force on it increases 1 - 3 times than that prior to failure. This can predict the failure of diamond-coated cutting tools.