Adsorption of copper using macroporous phosphonic acid resin

The adsorption behavior and mechanism of a novel chelate resin,macroporous phosphonic acid resin(PAR)for Cu(Ⅱ)were investigated.The statically saturated Cu(Ⅱ)adsorption capacity is 168 mg/g resin at 298K in HAc-NaAc medium.The Cu(Ⅱ)adsorbed on PAR can be eluted by 1.0-3.0 mol/L HCl and the elution percentage reaches 100%.The resin can be regenerated and reused without apparent decrease in adsorption capacity.The apparent adsorption rate constant is k=1.64× 10 4 s-1 at 298K.The adsorption behavior of PAR for Cu(Ⅱ)obeys the Freundlich isotherm.The thermodynamic adsorption parameters,enthalpy change △H,free energy spectively.The apparent activation energy is Ea =8.0 kJ/mol.The molar coordination ratio of the functional group of PAR to Cu(Ⅱ)is about 2:1.The adsorption mechanism of PAR for Cu(Ⅱ)was examined by chemical method and IR spectrometry.