Numerical Simulation of Superplastic Forming and Diffusion Bonding of Ti Alloys Numerical Simulation of Superplastic Forming and Diffusion Bonding of Ti Alloys

Numerical Simulation of Superplastic Forming and Diffusion Bonding of Ti Alloys

  • 期刊名字:材料科学技术学报
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  • 论文作者:Kaifeng ZHANG,Wenbo HAN,Wei WU
  • 作者单位:School of Materials Science and Engineering
  • 更新时间:2022-11-04
  • 下载次数:
论文简介

The research on numerical simulation for combinative process of SPF/DB is carried out in this paper. The contacting problem of sheets is analyzed by using the penalty method. In order to solve the contact problem of different parts of the sheet, a new alg

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