Thermal Flexure Measurement and Inverse Characterization for a Tri-layer Thin Plate

The paper presents a new study on a tri-layer thin plate.Shadow moiré implemented with an advanced phase unwrapping technique is employed to obtain actual flexural deformation of a real-life plate sample subjected to thermal loads.An analytical model is re-formulated to provide the plate with global closed-form solutions of the plate deflection as well as the interfacial stress and strain.With the measurements and the solutions available,an inverse iterative approach is developed to evaluate and maximize the correlation between the measured and the predicted thermal flexure,leading to ascertained materials' constitutive and thermal behaviour.The inverse search algorithm starts with estimated ranges of material property parameters and progressively updates them to finally approach the respective true values.The established model solutions along with the optimized material properties matrix enable an accurate evaluation of the interfacial stresses/strains for the specific plate sample.