IEC 62047-38-2021Semiconductor devices - Micro-electromechanical devices - Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection IEC 62047-38-2021Semiconductor devices - Micro-electromechanical devices - Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection

IEC 62047-38-2021Semiconductor devices - Micro-electromechanical devices - Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection

  • 标准类别:[IEC] 国际电工委员会标准
  • 标准大小:
  • 标准编号:IEC 62047-38-2021
  • 标准状态:
  • 更新时间:2022-04-01
  • 下载次数:
标准简介

IEC 62047-38-2021Semiconductor devices - Micro-electromechanical devices - Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection

标准截图