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BS IEC 62047-38-2021Semiconductor devices. Micro-electromechanical devices. Test method for adhesion strength of metal powder paste in MEMS interconnection BS IEC 62047-38-2021Semiconductor devices. Micro-electromechanical devices. Test method for adhesion strength of metal powder paste in MEMS interconnection

BS IEC 62047-38-2021Semiconductor devices. Micro-electromechanical devices. Test method for adhesion strength of metal powder paste in MEMS interconnection

  • 标准类别：[BS] 英国标准学会标准
  • 标准大小：
  • 标准编号：BS IEC 62047-38-2021
  • 标准状态：
  • 更新时间：2022-04-04
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BS IEC 62047-38-2021Semiconductor devices. Micro-electromechanical devices. Test method for adhesion strength of metal powder paste in MEMS interconnection

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