IEC 61191-2-2017 印制电路板组件--第2部分：分规范--表面安装焊接组件的要求 Printed board assemblies -- Part 2: Sectional specification -- Requirements for surface mount soldered assemblies

This part of IEC 61191 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. throughhole, chip mounting, terminal mounting, etc.).dition 3.0 2017-05 INTERNATIONAL STANDARD colour inside Printed board assemblies – Part 2: Sectional specification – Requirements for surface mount soldered assemblies IEC 61191-2:2017-05(en) THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright ？ 2017 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by a