IEC 62047-37-2020 半导体设备--微机电设备--第37部分:传感器用MEMS压电薄膜的环境试验方法 Semiconductor devices – Micro-electromechanical devices – Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application
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- 标准大小:
- 标准编号:IEC 62047-37-2020
- 标准状态:现行
- 更新时间:2023-10-30
- 下载次数:次
This part of IEC 62047 specifies test methods for evaluating the durability of MEMS piezoelectric thin film materials under the environmental stress of temperature and humidity and under mechanical stress and strain, and test conditions for appropriate quality assessment. Specifically, this document specifies test methods and test conditions for measuring the durability of a DUT under temperature and humidity conditions and applied voltages. It further applies to evaluations of direct piezoelectric properties in piezoelectric thin films formed primarily on silicon substrates, i.e. piezoelectric thin films used as acoustic sensors, or as cantilever-type sensors.
This document does not cover reliability assessments, such as methods of predicting the lifetime of a piezoelectric thin film based on a Weibull distribution.dition 1.0 2020-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Micro-electromechanical devices –
Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor
application
Dispositifs à semiconducteurs – Dispositifs microélectromécaniques –
Partie 37: Méthodes d’essai d’environnement des couches minces
piézoélectriques MEMS pour les applications de type capteur
IEC 62047-37:2020-04(en-
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