IEC 62047-27-2017 半导体设备--微机电设备--第27部分:使用微雪佛龙测试(MCT)法测试玻璃熔块粘合结构的粘结强度 　 Semiconductor devices – Micro-electromechanical devices Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

This part of IEC 62047 specifies a method for assessing the bond strength of glass frit bonded structures using micro-chevron-tests (MCT). It describes suitable sample geometry and provides guidance for the design of deviating sample geometries. The micro-chevron-test is an experimental method to determine the fracture toughness K of IC brittle materials or bond interfaces using specifically designed test chips (micro-chevron- samples) under defined load conditions (crack opening mode I). Owing to its high precision and low variance, it is suitable for analysing the influence of different process parameters on bond strength as well as for quality assurance.
 These operational instructions are applicable for symmetrically glass frit bonded silicon- silicon-stacks, i.e. the joint upper and lower chip of the chevron sample exhibit identical thickness and mechanical properties. The method is suitable for test samples, which are either produced directly from individual chips in corresponding dimensions, or for integrated samples, which have been singled out from processed wafers using suitable methods. This document determines preferential dimensions for samples as well as parameters for the test conditions. Deviating geometries can potentially influence the viability of the tests as well as the comparability of the results. On that score, all parameters are determined and documented accurately.dition 1.0 2017-01 INTERNATIONAL STANDARD colour inside Semiconductor devices – Micro-electromechanical devices Part 27: Bond strength test for glass frit bonded structures using micro-chevron- tests (MCT) IEC 62047-27:2017-01(en) THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright ？ 2017 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reprod