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GB/T 41033-2021CMOS 集成电路抗辐射加固设计要求Design requirements of radiation hardening for CMOS IC...2022-10-25

GB/T 41213-2021集成电路用全自动装片机Integrated circuit full automatic die bonder2022-10-25

GB/T 41325-2022集成电路用低密度晶体原生凹坑硅单晶抛光片Low density crystal originated pit polished monocryst...2022-10-26

GB/T 14028-2018半导体集成电路模拟开关测试方法2022-06-15

GB/T 16649.10-2002识别卡带触点的集成电路卡第10部分;同步卡的电信号和复位应答Identification cards-intergra...2022-06-15

SJ 50597/61-2005半导体集成电路JW1083/JW1084/JW1085/JW1086型三端可调正输出低压差电压调整器.详细规范...2022-06-14

SJ 52438/11-2002混合集成电路.HDA030型线性12位数字/模拟转换器详细规范2022-06-14

YD/T 2523-2013CDMA数字蜂窝移动通信网通用集成电路卡（UICC）与终端间接口测试方法终端CCAT应用特性...2022-06-14

QJ 2875-1997半导体集成电路CMOS数字门阵列详细规范2022-06-14

QJ 3092-1999半导体集成电路 HCT与门、与非门详细规范2022-06-14

SJ 21473.2-2018军用集成电路电磁抗扰度测量方法第2部分:辐射抗扰度测量 TEM小室和宽带TEM小室法...2022-06-13

SJ 20298-1993半导体集成电路JB555、JB556型时基电路详细规范Detail specification for Types JB555 and JB556 prec...2022-06-13

SJ 50597/52-2000半导体集成电路.JB537型电压频率转换器详细规范Semiconductor integrated circuits-Detail specifi...2022-06-13

SJ 2154-1982薄膜集成电路用微晶玻璃基片Miorocrystal glass substrates for use in thick film integrated circuit...2022-06-12

SJ 51420/2-1998半导体集成电路F型陶瓷扁平外壳详细规范Detail specification of Type F ceramic FP for semiconduc...2022-06-12

SJ 50597/62-2006半导体集成电路 JF1558、JF1558A 型通用双运算放大器详细规范2022-06-12

SJ 51420/1-1996半导体集成电路D型陶瓷双列外壳详细规范Detail specification of type D ceramic DIP for semicondu...2022-06-10

GB/T 16649.15-2010识别卡集成电路卡第15部分：密码信息应用Identification cards - Integrated circuit cards - Pa...2022-06-10

SJ 20161-1992半导体集成电路JT54LS273（373、374和377）型LS-TTL可级联触发器详细规范Detail specification for types ...2022-06-10

GB/T 15138-1994膜集成电路和混合集成电路外形尺寸Case outlines for film integrated circuits and hybrid integra...2022-06-10

SJ 20159-1992半导体集成电路JS54LS155和JT54LS156型LS-TTL译码器详细规范Detail specification for types JT54LS15...2022-06-10

SJ/Z 11360-2006集成电路IP核信号完整性规范2022-06-10

SJ 20954-2006集成电路锁定试验2022-06-10

SJ 50597/21-1994半导体集成电路.JADC1001型通用8位二进制输出A/D转换器详细规范Semiconductor integrated circuits...2022-06-10

SJ 20961-2006集成电路A/D和D/A转换器测试方法的基本原理2022-06-10

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