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IEC 61191-2-2017 印制电路板组件--第2部分：分规范--表面安装焊接组件的要求 Printed board assemblies -- Part 2: Sectional specification -- Requirements for surface mount soldered assemblies
This part of IEC 61191 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. throughhole, chip mounting, terminal mounting, etc.)....
2023-08-20 15:48:01浏览：20
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DB44/T 622-2009 印制电路板行业废水治理工程技术规范 Technica-Specification for Wastewater Treatment Engineering of Printed Circuit Board Manufacturing
本规范适用于印制电路板生产过程所产生的废水治理工程的规划、设计、施工及安装、调试、验收和运行管理。<br /> ...
2023-06-03 05:36:01浏览：47
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IEC 61189-5-1-2016电气材料、印制电路板和其他互连结构及组件的试验方法--第5-1部分:材料与组合装置的通用试验方法 印制板组件导则Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance fo
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.<br />This part of IEC 61189 contains the types of content of the IEC 61189-5 series, as well as guidance documents and handbooks for printed board assemblies....
2023-04-18 13:20:01浏览：24
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印制电路板的热设计和热分析
热设计和热分析是提高印制电路板热可靠性的重要方法,基于热设计和热分析的基本理论,结合近几年的印制电路板设计经验,从元器件的使用、印制板的选材、构造、元器件的安装和布局和其他要求等方面讨论了印制电路板热设计的具体措施和方法,并简要地介绍了印制电路板热分析的概念、主要技术和主要作用....
2020-09-03 16:42:35浏览：53
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